- 14TH, 13TH & 12TH GEN CORE – The PRO B760-P DDR4 II (ATX) employs a 12 Duet Rail Power System (P-PAK) VRM for the Intel B760 chipset (LGA 1700, 14th, 13th & 12th Gen); The VRM features MSI Core Boost technology for improved stability & performance
- INTEGRATED COOLING – VRM cooling features 7W/mK MOSFET thermal pads and an extended heatsink; Includes chipset heatsink, M.2 Shield Frozr, active Frozr AI CPU & GPU responsive cooling, a dedicated pump-fan header & 6-layer PCB with 2 oz. thickened copper
- DDR4 MEMORY, PCIe 4.0 x16 SLOTS – 4 x DDR4 DIMM slots with Memory Boost isolated circuitry for overclocking (1DPC 1R, 5333+ MHz); Primary PCIe x16 slot supports PCIe 4.0 (64GB/s) and includes Steel Armor, secondary PCIe x16 slot also supports PCIe 4.0
- DUAL M.2 CONNECTORS – Storage options include 2 x M.2 Gen4 x4 64Gbps slots; The primary M.2 slot includes Shield Frozr to prevent thermal throttling during hyper-fast SSD access
- WELL CONNECTED – Network hardware includes a 2.5Gbps LAN controller; Rear ports include USB 3.2 Gen 2 Type-C (10Gbps), HDMI 2.1, DisplayPort 1.4, and 7.1 HD Audio with Audio Boost
Business Elegance
The PRO B760-P WIFI DDR4 is a business-oriented ATX motherboard featuring the latest Intel B760 chipset that supports ample RAM capacity.
Supports Intel Core 12th & 13th Gen Processors
The PRO B760-P WIFI DDR4 motherboard supports 12th & 13th Gen Intel Core, Pentium Gold, and Celeron processors.
Form Factor: ATX
Socket Type: LGA 1700
Chipset: Intel B760
12+1 Duet Rail Power System with P-PAK
With its 8 pin + 4 pin power connectors and exclusive Core Boost technology, the PRO B760-P WIFI DDR4 is able to sustain heavy CPU power loads to support system-demanding work settings:
1. Digital PWM IC
2. 12-Phase Duet Rail CPU Power (P-PAK)
3. 1-Phase GT Power
4. 1-Phase AUX Power
Integrated Cooling Features
VRM Cooling: Features an extended heatsink, 7W/mK MOSFET thermal pads and additional choke thermal pads for improved thermal dissipation.
PCB Cooling: Premium 6-layer printed circuit design with 2 oz. thickened copper improves heat dissipation & reliability.
SSD Cooling: M.2 Shield Frozr prevents thermal throttling.
Frozr AI Cooling: Automatically adjusts system fan settings based on CPU & GPU temperatures.
4 x DDR4 Dual Channel (5333 MHz OC)*
Memory Boost: A fully-isolated DDR circuit delivers pure data signals for optimal gaming and overclocking performance.
XMP profiles in MSI BIOS are MSI OC LAB optimized and can be easily enabled with auto power settings for optimized memory speed and stability.
* 1DPC 1R Max. overclocking frequency 5333+ MHz, supports Intel XMP.
Fortified PCIe 4.0 x16
MSI PCI Express Steel Armor slots are secured to the motherboard with extra solder points to support the weight of heavy graphics cards. When every advantage in games counts, Steel Armor also shields the point of contact from electromagnetic interference:
2 x PCIe 4.0/3.0 x16 slots* (primary slot with Steel Armor)
3 x PCIe 3.0 x1 slot
* Supports x16/x4
M.2 Shield Frozr
Even the world’s fastest SSDs will automatically slow if thermal throttling firmware detects excessively high temperatures.
M.2 Shield Frozr is MSI’s most advanced thermal solution, offering the best possible protection to ensure maximum SSD transfer speed performance.
Gen4 M.2 Connectors
The PRO B760-P WIFI DDR4 motherboard features MSI’s Gen4 M.2 slots:
2 x Gen4 x4 64Gbps slots*
* 1 with M.2 Shield Frozr
Wi-Fi 6E & Bluetooth 5.3
2.5G LAN: A Realtek 2.5Gbps LAN controller delivers a premium network experience.
Wi-Fi 6E: Features the latest Intel Wi-Fi 6E module (ultra-low latency, high-bandwidth) & Bluetooth 5.3 technology.
USB 3.2 Gen 2 Type-C: Connect to devices and transfer files at high bandwidth rates: 10Gbps.
HD Audio: 7.1-Channel High Definition Audio with Audio Boost.
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